Metallography Consumables
Colloidal Silica Suspension
Final polishing suspension for stress-free, scratch-free surfaces
PRODUCT OVERVIEW
Colloidal silica polishing suspension for final polishing of metallographic specimens. Combines chemical and mechanical polishing action for a truly deformation-free, scratch-free surface finish.
TECHNICAL SPECIFICATIONS
Particle Size0.04µm (40nm)
Concentration30–40% SiO₂
pH9.5–10.5
BaseWater-based
Packaging250mL, 1L, 5L
Shelf Life12 months
APPLICATIONS
- EBSD specimen preparation
- OIM analysis specimens
- Aluminium and soft metals
- Final polishing after diamond
- Stress-sensitive materials
KEY FEATURES
- Chemical-mechanical polishing action
- Deformation-free surface for EBSD
- Suitable for soft and reactive metals
- Essential for electron backscatter diffraction
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Polishing Suspensions & Media