Metallography Equipment
Diamond Wafering Saw
Ultra-thin sectioning with diamond blade for delicate specimens
PRODUCT OVERVIEW
A diamond wafering saw for ultra-thin, low-deformation sectioning of ceramics, semiconductors, composites, and other hard or brittle materials. Produces sections as thin as 0.1mm with minimal damage.
TECHNICAL SPECIFICATIONS
Blade Diameter100mm to 150mm
Blade Thickness0.3mm to 1.0mm
Speed0 to 500 rpm variable
FeedGravity or motorised feed
Section ThicknessAs thin as 0.1mm
CoolantWater-based or oil coolant
APPLICATIONS
- Semiconductor wafer sectioning
- Ceramic and glass cutting
- Composite material sectioning
- Thin film cross-sections
- Geological sample preparation
KEY FEATURES
- Ultra-thin sections with minimal damage
- Diamond blade for hard and brittle materials
- Variable speed for material-specific cutting
- Gravity feed for gentle, controlled cutting
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Cutting & Sectioning Equipment